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新產(chǎn)品·新技術(shù)信息

Master Bond推出電子工業(yè)用雙組份環(huán)氧多硫化合物

來源：林中祥膠粘劑技術(shù)信息網(wǎng)2015年05月26日

閱讀次數(shù)：次

Master Bond introduces EP21TPFL-1AO, an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU in/ft2 hr °F [1.30-1.44 W/(m K)].

As a polysulfide based system, EP21TPFL-1AO has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. EP21TPFL-1AO has unusual blend of properties, enables EP21TPFL-1AO to be a candidate for a variety of bonding, sealing, coating and encapsulation applications in the electronic, aerospace, specialty OEM and related industries.

With an elongation of 150-200%, EP21TPFL-1AO offers a high degree of flexibility and it can withstand intense thermal cycling and mechanical shock. EP21TPFL-1AO is a low viscosity system also has a hardness of 70-90 Shore A. The mix ratio is a forgiving two to three by weight or volume. Color coding facilitates mixing. Part A is black and Part B is off-white. Working life is a conveniently long 90-120 minutes at 75°F.

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